- Components: Intel NAND Flash Memory Multi-Level Cell (MLC) Technology
- Capacity: 300 GB
- Form Factor: 2.5" 7mm
- Interface: SATA 3.0 3Gb/S
- Lithography Type: 25 nm
Essentials | |
Status | End of Life |
Launch Date | Q3'11 |
Sequential Read | 270 MB/s |
Sequential Write | 210 MB/s |
Random Read (100% Span) | 38500 IOPS |
Random Write (100% Span) | 2000 IOPS |
Latency - Read | 75 µs |
Latency - Write | 85 µs |
Power - Active | 3.7 W (64K Sequential Write) |
Power - Idle | 700 mW (Non-DIPM) |
Vibration - Operating | 2.17 GRMS (5-700 Hz) |
Vibration - Non-Operating | 3.13 GRMS (5-800 Hz) |
Shock (Operating and Non-Operating) | 1,500 G/.5 msec |
Operating Temperature Range | 0°C to 70°C |
Weight | up to 80 ± 2 grams |
Mean Time Between Failures (MTBF) | 2,000,000 Hours |
Uncorrectable Bit Error Rate (UBER) | 1 sector per 1016 |
Recommended Customer Price | N/A |
Package Specifications | |
Components | Intel NAND Flash Memory Multi-Level Cell (MLC) Technology |
Capacity | 300 GB |
Form Factor | 2.5" 7mm |
Interface | SATA 3.0 3Gb/S |
Lithography Type | 25 nm |
Advanced Technologies | |
Enhanced Power Loss Data Protection | Yes |
Hardware Encryption | AES 128 bit |
?High Endurance Technology (HET) | Yes |
Temperature Monitoring and Logging | Yes |
End-to-End Data Protection | No |