Essentials | |
---|---|
Capacity | 1200 GB |
Status | Launched |
Launch Date | Q3'16 |
Lithography Type | 3D NAND G1 MLC |
Performance | |
Sequential Read (up to) | 1700 MB/s |
Sequential Write (up to) | 1300 MB/s |
Random Read (100% Span) | 320000 IOPS |
Random Write (100% Span) | 26000 IOPS |
Latency - Read | 20 µs |
Latency - Write | 20 µs |
Power - Active | Avg. 11W (Write), 9W (Read) |
Power - Idle | 4W |
Reliability | |
Vibration - Operating | 2.17 GRMS |
Vibration - Non-Operating | 3.13 GRMS |
Shock (Operating and Non-Operating) | 1000 G/0.5msec |
Operating Temperature Range | 0°C to 55°C |
Endurance Rating (Lifetime Writes) | 1480 TBW |
Mean Time Between Failures (MTBF) | 2 million hours |
Uncorrectable Bit Error Rate (UBER) | 1 sector per 10^17 bits read |
Warranty Period | 5 yrs |
Package Specifications | |
Weight | Up to 190gm |
Form Factor | HHHL (CEM2.0) |
Interface | PCIe NVMe 3.0 x4 |
Advanced Technologies | |
Enhanced Power Loss Data Protection | Yes |
Hardware Encryption | AES 256 bit |
High Endurance Technology (HET) | No |
Temperature Monitoring and Logging | Yes |
End-to-End Data Protection | Yes |